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SPI NAND Flash

Density

Org.

Part Number

VDD(V)

Page Size

Speed(MHz)

ECC

Package

Availability

1G bit

x8

STF1GE4U00M-AE00

STF1GE4U00M-CE00

2.7~3.6

2K+64

104/133

1

8p WSON

16p SOIC

Now

2G bit

x8

STF2GE4U00M-AE00

STF2GE4U00M-CE00

2.7~3.6

2K+64

104/133

1

8p WSON

16p SOIC

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4G bit

x8

STF4GE4U00M-MC00

2.7~3.6

2K+128

80

8

8p LGA

Now

* Part Number : STFXXXXXXXX-pt00

1. p : Package type

A=8 pad WSON (8x6mm), C=16pin SOIC (300mil), M=8 pad LGA (8x6mm)

2. t : Temperature

C=Commercial Temperature (0~70C), E=Extended Temperature (-30~85C)